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  4. Electron Mobility Enhancement in GeSn n-Channel MOSFETs by Tensile Strain
 
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Electron Mobility Enhancement in GeSn n-Channel MOSFETs by Tensile Strain

Journal
IEEE Electron Device Letters
Journal Volume
42
Journal Issue
1
Pages
10-13
Date Issued
2021
Author(s)
Chuang Y
Liu C.-Y
Luo G.-L
JIUN-YUN LI  
DOI
10.1109/LED.2020.3041051
URI
https://www.scopus.com/inward/record.uri?eid=2-s2.0-85098648827&doi=10.1109%2fLED.2020.3041051&partnerID=40&md5=d6cae0ef23b9fba24d23f88ab45f44ac
https://scholars.lib.ntu.edu.tw/handle/123456789/581010
Abstract
A record high electron mobility of 698 cm2/ Vcs in a tensile-strained Ge0.96Sn0.04 nMOSFET is demonstrated in this letter. High-quality GeSn films were epitaxially grown by lowerature chemical vapor deposition. Different strain conditions in the active GeSn layers were achieved by Ge or GeSn relaxed buffers. A mesa FET structure was used to effectively reduce the OFF leakage by a recessed p/n junction in Ge. The ION/IOFF ratio in the mesa GeSn FETs is boosted by a factor of 100 compared to conventional planar devices. As the GeSn film becomes more tensile strained, the channel mobility is enhanced, which could be attributed to a higher carrier population in the Γ valley. ? 1980-2012 IEEE.
Subjects
Chemical vapor deposition; Electron mobility; Hall mobility; Hole mobility; MOSFET devices; Semiconductor alloys; Tensile strain; Carrier population; Channel mobility; Epitaxially grown; High electron mobility; Mobility enhancement; Planar devices; Relaxed buffer; Strain conditions; Tin alloys
Type
journal article

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