https://scholars.lib.ntu.edu.tw/handle/123456789/351856
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | C.-C. Tsai | en_US |
dc.contributor.author | Y.-S. Cheng | en_US |
dc.contributor.author | T.-Y. Huang | en_US |
dc.contributor.author | R.-B. Wu | en_US |
dc.contributor.author | RUEY-BEEI WU | zz |
dc.creator | C.-C. Tsai;Y.-S. Cheng;T.-Y. Huang;R.-B. Wu | - |
dc.date.accessioned | 2018-09-10T07:41:22Z | - |
dc.date.available | 2018-09-10T07:41:22Z | - |
dc.date.issued | 2009-12 | - |
dc.identifier.uri | http://scholars.lib.ntu.edu.tw/handle/123456789/351856 | - |
dc.language | en | en |
dc.relation.ispartof | 2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009 | en_US |
dc.source | AH-anncc | - |
dc.title | A wide-band microstrip-to- microstrip multi-layered via transition using LTCC technology | - |
dc.type | conference paper | en |
dc.identifier.doi | 10.1109/EDAPS.2009.5403997 | - |
dc.identifier.scopus | 2-s2.0-77950277304 | - |
item.openairecristype | http://purl.org/coar/resource_type/c_5794 | - |
item.openairetype | conference paper | - |
item.grantfulltext | none | - |
item.cerifentitytype | Publications | - |
item.fulltext | no fulltext | - |
crisitem.author.dept | Electrical Engineering | - |
crisitem.author.dept | Communication Engineering | - |
crisitem.author.dept | MediaTek-NTU Research Center | - |
crisitem.author.orcid | 0000-0001-5735-2152 | - |
crisitem.author.parentorg | College of Electrical Engineering and Computer Science | - |
crisitem.author.parentorg | College of Electrical Engineering and Computer Science | - |
crisitem.author.parentorg | Others: University-Level Research Centers | - |
顯示於: | 電機工程學系 |
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