Skip to main content
English
中文
Log In
Log in
Log in with ORCID
NTU Single Sign On
Have you forgotten your password?
Home
College of Electrical Engineering and Computer Science / 電機資訊學院
Electrical Engineering / 電機工程學系
The demonstration of nonlinear analytic model for the strain field induced by thermal copper filled TSVs (through silicon via)
Details
The demonstration of nonlinear analytic model for the strain field induced by thermal copper filled TSVs (through silicon via)
Journal
AIP Advances
Journal Volume
3
Journal Issue
8
Date Issued
2013
Author(s)
M. H.Liao
G.-H. Liu
M.-Y. Yu
C.-H. Chen
C.-X. Hong
DOI
10.1063/1.4819467
URI
https://scholars.lib.ntu.edu.tw/handle/123456789/404559
Type
journal article
