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College of Electrical Engineering and Computer Science / 電機資訊學院
Electrical Engineering / 電機工程學系
The demonstration of nonlinear analytic model for the strain field induced by thermal copper filled TSVs (through silicon via)
Details
The demonstration of nonlinear analytic model for the strain field induced by thermal copper filled TSVs (through silicon via)
Journal
AIP Advances
Journal Volume
3
Journal Issue
8
Date Issued
2013
Author(s)
M. H.Liao
G.-H. Liu
M.-Y. Yu
C.-H. Chen
C.-X. Hong
DOI
10.1063/1.4819467
URI
https://scholars.lib.ntu.edu.tw/handle/123456789/404559
Type
journal article