https://scholars.lib.ntu.edu.tw/handle/123456789/404559| Title: | The demonstration of nonlinear analytic model for the strain field induced by thermal copper filled TSVs (through silicon via) | Authors: | M. H.Liao G.-H. Liu M.-Y. Yu C.-H. Chen C.-X. Hong |
Issue Date: | 2013 | Journal Volume: | 3 | Journal Issue: | 8 | Source: | AIP Advances | URI: | https://scholars.lib.ntu.edu.tw/handle/123456789/404559 | ISSN: | 2158-3226 | DOI: | 10.1063/1.4819467 |
| Appears in Collections: | 電機工程學系 |
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.