Construction of acceleration factor model for electronic packages under temperature cycling loading by finite element method
Journal
2015 IFToMM World Congress
ISBN
9789860460988
Date Issued
2015
Author(s)
Abstract
The reliability and fatigue life of electronic packages are always a major concern to engineers. Finite element method (FEM) and accelerated life testing (ALT) are frequently employed to study the reliability of electronic packages and/or its products. FEM is used to predict the fatigue life of a package by observing physical processes that lead to failure, while ALT is carried out to correlate an electronic product's fatigue life with different environmental conditions in the form of acceleration factors (AF). This study intends to present an approach to predict fatigue lives of an electronic package under various environments by using FEM as a substitute for ALT since it generates testing data without carrying out costly experiments. Lt takes less time than real ALT as well. An FEM model of the plastic ball grid array (PBGA) is constructed and used for demonstration. The result shows the analytical procedure employed in this study has its feasibility and efficiency.
Publisher
National Taiwan University
Type
conference paper