https://scholars.lib.ntu.edu.tw/handle/123456789/414999| Title: | Thermal fatigue life and reliability evaluation of die attachment layer of high power LED under thermal cycling conditions | Authors: | Hsu Y. Wu W.-F. Lai S.-L. |
Issue Date: | 2014 | Publisher: | Institute of Electrical and Electronics Engineers Inc. | Journal Volume: | 2 | Start page/Pages: | 1030-1033 | Source: | 2014 International Conference on Information Science, Electronics and Electrical Engineering | URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-84913602122&doi=10.1109%2fInfoSEEE.2014.6947825&partnerID=40&md5=8b84d45ba69ce7f35f03ab7f162b4f70 https://scholars.lib.ntu.edu.tw/handle/123456789/414999 |
ISBN: | 9781479931965 | DOI: | 10.1109/InfoSEEE.2014.6947825 |
| Appears in Collections: | 機械工程學系 |
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