https://scholars.lib.ntu.edu.tw/handle/123456789/415004
Title: | An analytical procedure for estimating field lifetime and failure rate of electronic packages | Authors: | Hsu Y. Su C.-Y. Wu W.-F. |
Issue Date: | 2014 | Journal Volume: | 37 | Journal Issue: | 1 | Start page/Pages: | 36-43 | Source: | Journal of the Chinese Institute of Engineers, Transactions of the Chinese Institute of Engineers,Series A | URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-84892904696&doi=10.1080%2f02533839.2012.751333&partnerID=40&md5=031975d6db0472915e99947c8b92c125 https://scholars.lib.ntu.edu.tw/handle/123456789/415004 |
ISSN: | 2533839 | DOI: | 10.1080/02533839.2012.751333 |
Appears in Collections: | 機械工程學系 |
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