https://scholars.lib.ntu.edu.tw/handle/123456789/415013| Title: | Fatigue life and reliability prediction of electronic packages under thermal cycling conditions through FEM analysis and acceleration models | Authors: | Huang X. Wu W.-F. Chou P.-L. |
Issue Date: | 2012 | Source: | 14th International Conference on Electronic Materials and Packaging | URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-84880312400&doi=10.1109%2fEMAP.2012.6507914&partnerID=40&md5=e4269152e84dca02b321336ff46967b3 https://scholars.lib.ntu.edu.tw/handle/123456789/415013 |
ISBN: | 9781467349444 | DOI: | 10.1109/EMAP.2012.6507914 |
| Appears in Collections: | 機械工程學系 |
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