Vibration induced fatigue reliability of BGA packages

Journal

2008 10th International Conference on Electronic Materials and Packaging

Pages

305-308

ISBN

9781424436217

Date Issued

2008

Author(s)

Yao H.

Kong W.-K.

Su C.Y.

Liu M.-W.

DOI

10.1109/EMAP.2008.4784289

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-64049097897&doi=10.1109%2fEMAP.2008.4784289&partnerID=40&md5=f5db87a9c2edb79f61f8cf2f92bb8aa9

https://scholars.lib.ntu.edu.tw/handle/123456789/415026

SDGs

[SDGs]SDG12

Type

conference paper