https://scholars.lib.ntu.edu.tw/handle/123456789/415088
標題: | Thermal-Cyclic Fatigue Life Analysis and Reliability Estimation of a FCCSP based on Probabilistic Design Concept, | 作者: | Hsu, Y. Su, C.Y. Wu, W.F. |
關鍵字: | Electronic package; Fatigue life; Probabilistic design; Reliability | 公開日期: | 2013 | 卷: | 36 | 期: | 2 | 起(迄)頁: | pp. 155-176 | 來源出版物: | Computers, Materials and Continua | 摘要: | To study the fatigue reliability of a flip-chip chip scale package (FCCSP) subject to thermal cyclic loading, a Monte Carlo simulation-based parametric study is carried out in the present study. A refined procedure as compared with the recently released Probabilistic Design System (PDS) of ANSYS is proposed and employed in particular. The thermal-cyclic fatigue life of the package is discussed in detail since it is related directly to the reliability of the package. In consideration of the analytical procedure as well as real manufacturing processes, a few geometric dimensions and material properties of the package are assumed random. The empirical parameters used in the fatigue life prediction formula are also assumed random to account for their uncertainties. Numerical calculation is performed following the standard finite element analysis procedure. The result indicates that PDS can indeed be employed to find the cumulative thermal-cyclic fatigue life distribution of the electronic package owing to various uncertainties. The proposed refined design procedure can further improve the accuracy of the quantitative reliability estimation. Copyright © 2013 Tech Science Press. |
URI: | https://scholars.lib.ntu.edu.tw/handle/123456789/415088 https://www.scopus.com/inward/record.uri?eid=2-s2.0-84893555358&partnerID=40&md5=2a25fc292655de6fe0ed9c8b255551a3 |
ISSN: | 15462218 | SDG/關鍵字: | Electronic package; Fatigue life analysis; Fatigue life prediction; Manufacturing process; Probabilistic design; Reliability estimation; Standard finite element; Thermal cyclic loading; Monte Carlo methods; Reliability; Reliability analysis; Fatigue of materials |
顯示於: | 機械工程學系 |
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