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College of Engineering / 工學院
Mechanical Engineering / 機械工程學系
Drop Impact Life Prediction and Reliability Assessment of Electronic Packages
Details
Drop Impact Life Prediction and Reliability Assessment of Electronic Packages
Journal
The IVth European Conference on Computational Mechanics
Date Issued
2010
Author(s)
Hsu, Y.
Wu, W.F.
Tsai, T.Y.
Su, C.Y.
URI
https://scholars.lib.ntu.edu.tw/handle/123456789/415548
Type
conference paper