https://scholars.lib.ntu.edu.tw/handle/123456789/424988
Title: | Viscoelastic stress relaxation in film/substrate systems - Kelvin model | Authors: | Ko S.-C. Lee S. Hsueh C.-H. CHUN-HWAY HSUEH |
Issue Date: | 2003 | Journal Volume: | 93 | Journal Issue: | 5 | Start page/Pages: | 2453-2457 | Source: | Journal of Applied Physics | Abstract: | An analytical model was developed to study the viscoelastic stress relaxation in film/substrate systems. The viscous flow was assumed to follow the Kelvin model, and the viscoelastic solution was obtained from existing elastic solution using Laplace transform. Results indicated that the stress relaxation rate increased with decreased film-to-substrate thickness ratio. |
URI: | https://scholars.lib.ntu.edu.tw/handle/123456789/424988 | ISSN: | 00218979 | DOI: | 10.1063/1.1541108 |
Appears in Collections: | 材料科學與工程學系 |
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