Simulation studies on bipolar electrostatic chucks
Journal
2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference
Pages
382-385
ISBN
9781467383561
Date Issued
2015
Author(s)
Abstract
We use Comsol Multiphysics, a finite element simulation tool to study a bipolar electrostatic chuck (E-chuck). The influences of the substrate and dielectric types, wafer thickness, and air gap are investigated. ? 2015 IEEE.
Type
conference paper