https://scholars.lib.ntu.edu.tw/handle/123456789/425262| Title: | Simulation studies on bipolar electrostatic chucks | Authors: | Li C.-H. Chiu Y.-F. Yu Y.-H. Chen J.-Z. JIAN-ZHANG CHEN |
Issue Date: | 2015 | Start page/Pages: | 382-385 | Source: | 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings | Abstract: | We use Comsol Multiphysics, a finite element simulation tool to study a bipolar electrostatic chuck (E-chuck). The influences of the substrate and dielectric types, wafer thickness, and air gap are investigated. ? 2015 IEEE. |
Description: | 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015,21 October 2015 through 23 October 2015, |
URI: | https://scholars.lib.ntu.edu.tw/handle/123456789/425262 | ISBN: | 9781467383561 | DOI: | 10.1109/IMPACT.2015.7365233 |
| Appears in Collections: | 應用力學研究所 |
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