|Title:||Simulation studies on bipolar electrostatic chucks||Authors:||Li C.-H.
|Issue Date:||2015||Start page/Pages:||382-385||Source:||2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings||Abstract:||
We use Comsol Multiphysics, a finite element simulation tool to study a bipolar electrostatic chuck (E-chuck). The influences of the substrate and dielectric types, wafer thickness, and air gap are investigated. ? 2015 IEEE.
10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015,21 October 2015 through 23 October 2015,
|Appears in Collections:||應用力學研究所|
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