An accurate and fast substrate noise prediction method with octagonal TSV model for 3-D ICs

Journal

IEEE Transactions on Electromagnetic Compatibility

Journal Volume

59

Journal Issue

5

Pages

66004

Date Issued

2017

Author(s)

Y.-A. Hsu

C.-H. Cheng

Y.-C. Lu

T.-L. Wu

DOI

10.1109/temc.2017.2665666

URI

https://scholars.lib.ntu.edu.tw/handle/123456789/427814

Type

journal article