https://scholars.lib.ntu.edu.tw/handle/123456789/427878
Title: | Novel RDL design of wafer-level packaging for signal/power integrity in LPDDR4 application | Authors: | K.-B. Wu T.-Y. Kuo B. Hung B. Lin C. Peng M.-T. Yang R.-B. Wu RUEY-BEEI WU |
Issue Date: | 2018 | Journal Volume: | 8 | Journal Issue: | 8 | Start page/Pages: | 1675-1686 | Source: | IEEE Transactions on Components, Packaging, and Manufacturing Technology | URI: | https://scholars.lib.ntu.edu.tw/handle/123456789/427878 | ISSN: | 21563950 | DOI: | 10.1109/tcpmt.2018.2850528 |
Appears in Collections: | 電機工程學系 |
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