https://scholars.lib.ntu.edu.tw/handle/123456789/428602
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Lin, Chiung-Wen | en_US |
dc.contributor.author | Yang, Hsueh-An | en_US |
dc.contributor.author | Wang, Wei Chung | en_US |
dc.contributor.author | WEICHUNG WANG | en_US |
dc.creator | Lin, Chiung-Wen;Yang, Hsueh-An;Wang, Wei Chung;Fang, Weileun | - |
dc.date.accessioned | 2019-10-28T03:21:28Z | - |
dc.date.available | 2019-10-28T03:21:28Z | - |
dc.date.issued | 2007 | - |
dc.identifier.issn | 0960-1317 | - |
dc.identifier.uri | https://scholars.lib.ntu.edu.tw/handle/123456789/428602 | - |
dc.relation.ispartof | Journal of Micromechanics and Microengineering | - |
dc.title | Implementation of three-dimensional SOI-MEMS wafer-level packaging using through-wafer interconnections | - |
dc.type | journal article | en |
dc.identifier.doi | 10.1088/0960-1317/17/6/014 | - |
dc.identifier.isi | WOS:000246851400016 | - |
dc.relation.pages | 1200-1205 | - |
dc.relation.journalvolume | 17 | - |
dc.relation.journalissue | 6 | - |
item.fulltext | no fulltext | - |
item.openairetype | journal article | - |
item.openairecristype | http://purl.org/coar/resource_type/c_6501 | - |
item.grantfulltext | none | - |
item.cerifentitytype | Publications | - |
crisitem.author.dept | Applied Mathematical Sciences | - |
crisitem.author.dept | Center for Artificial Intelligence and Advanced Robotics | - |
crisitem.author.orcid | 0000-0002-6154-7750 | - |
crisitem.author.parentorg | College of Science | - |
crisitem.author.parentorg | Others: University-Level Research Centers | - |
顯示於: | 應用數學科學研究所 |
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