https://scholars.lib.ntu.edu.tw/handle/123456789/428602
Title: | Implementation of three-dimensional SOI-MEMS wafer-level packaging using through-wafer interconnections | Authors: | Lin, Chiung-Wen Yang, Hsueh-An Wang, Wei Chung WEICHUNG WANG |
Issue Date: | 2007 | Journal Volume: | 17 | Journal Issue: | 6 | Start page/Pages: | 1200-1205 | Source: | Journal of Micromechanics and Microengineering | URI: | https://scholars.lib.ntu.edu.tw/handle/123456789/428602 | ISSN: | 0960-1317 | DOI: | 10.1088/0960-1317/17/6/014 |
Appears in Collections: | 應用數學科學研究所 |
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