Thermal modeling and analysis for 3D-ICs with integrated microchannel cooling

Journal

IEEE Trans. Computer-Aided Design of Integrated Circuits and Systems

Journal Volume

30

Journal Issue

9

Pages

14470

Date Issued

2011

Author(s)

Hitoshi Mizunuma

Yi-Chang Lu

Chia-Lin Yang

URI

https://scholars.lib.ntu.edu.tw/handle/123456789/429926

Type

journal article