Testing of TSV-induced small delay faults for 3-D integrated circuits

Journal

IEEE Trans. Very Large Scale Integration (VLSI) Systems

Journal Volume

22

Journal Issue

3

Pages

2043-2052

Date Issued

2014

Author(s)

Chun-Yi Kuo

Chi-Jih Shih

Yi-Chang Lu

James C.-M. Li

Krishnendu Chakrabarty

DOI

10.1109/tvlsi.2013.2250320

URI

https://scholars.lib.ntu.edu.tw/handle/123456789/429927

Type

journal article