Structural evolution and electrochemical performance of sputter-deposited Cu6 Sn5 thin-film anodes

Journal

Journal of the Electrochemical Society

Journal Volume

154

Journal Issue

5

Pages

A433-A437

Date Issued

2007

Author(s)

Chiu K.-F.

Lin K.M.

Lin H.C.

Chen W.Y.

Shieh D.T.

DOI

10.1149/1.2712830

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-34047186953&doi=10.1149%2f1.2712830&partnerID=40&md5=6a4297abb9d164a1d07a3a9b50183a7d

https://scholars.lib.ntu.edu.tw/handle/123456789/432483

Type

journal article