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College of Engineering / 工學院
Materials Science and Engineering / 材料科學與工程學系
Structural evolution and electrochemical performance of sputter-deposited Cu6 Sn5 thin-film anodes
Details
Structural evolution and electrochemical performance of sputter-deposited Cu6 Sn5 thin-film anodes
Journal
Journal of the Electrochemical Society
Journal Volume
154
Journal Issue
5
Pages
A433-A437
Date Issued
2007
Author(s)
Chiu K.-F.
Lin K.M.
Lin H.C.
Chen W.Y.
Shieh D.T.
HSIN-CHIH LIN
DOI
10.1149/1.2712830
URI
https://www.scopus.com/inward/record.uri?eid=2-s2.0-34047186953&doi=10.1149%2f1.2712830&partnerID=40&md5=6a4297abb9d164a1d07a3a9b50183a7d
https://scholars.lib.ntu.edu.tw/handle/123456789/432483
Type
journal article