Electrical resistivity of Ti-Ni binary and Ti-Ni-X (X = Fe, Cu) ternary shape memory alloys

Journal

Materials Science and Engineering A

Journal Volume

438-440

Journal Issue

SPEC. ISS.

Pages

536-539

Date Issued

2006

Author(s)

Wu S.K.

Lin H.C.

DOI

10.1016/j.msea.2005.12.059

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-33750458005&doi=10.1016%2fj.msea.2005.12.059&partnerID=40&md5=f19e10ee63bcb22451175f666805be83

https://scholars.lib.ntu.edu.tw/handle/123456789/432488

Type

journal article