Low temperature and pressureless microfluidic electroless bonding process for vertical interconnections

Journal

Electronic Components and Technology Conference

Journal Volume

2019-May

Pages

1729-1734

ISBN

9781728114989

Date Issued

2019

Author(s)

Hung H.-T.

Yang S.

Weng I.-A.

Chen Y.-H.

DOI

10.1109/ECTC.2019.00265

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-85072282682&doi=10.1109%2fECTC.2019.00265&partnerID=40&md5=a75307e297c1d071705b4252d9efdb54

https://scholars.lib.ntu.edu.tw/handle/123456789/432562

Publisher

Institute of Electrical and Electronics Engineers Inc.

Type

conference paper