Refine microstructure of solder materials via minor element additions

Journal

13th Electronic Circuits World Convention: Connecting the World

ISBN

9783800736065

Date Issued

2019

Author(s)

Chung C.K.

Yu J.J.

Yang T.L.

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-85073554472&partnerID=40&md5=51ca09aa458c6006105649602d8acdc5

https://scholars.lib.ntu.edu.tw/handle/123456789/432571

Publisher

VDE Verlag GmbH

Type

conference paper