https://scholars.lib.ntu.edu.tw/handle/123456789/432574
Title: | Microstructure Evolution of Cu/In/Cu Joints after Solid-Liquid Interdiffusion | Authors: | Chiu Y.S. C. ROBERT KAO |
Issue Date: | 2018 | Publisher: | Institute of Electrical and Electronics Engineers Inc. | Journal Volume: | 2018-May | Start page/Pages: | 890-895 | Source: | Electronic Components and Technology Conference | URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-85051920422&doi=10.1109%2fECTC.2018.00137&partnerID=40&md5=a3e44d9a4bd0829b757008dd5b349d5f https://scholars.lib.ntu.edu.tw/handle/123456789/432574 |
ISBN: | 9781538649985 | ISSN: | 05695503 | DOI: | 10.1109/ECTC.2018.00137 |
Appears in Collections: | 材料科學與工程學系 |
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