Analyses and design for electrochemical migration suppression by alloying indium into silver

Journal

Journal of Materials Science: Materials in Electronics

Journal Volume

29

Journal Issue

16

Pages

13878-13888

Date Issued

2018

Author(s)

Yang C.A.

Wu J.

Lee C.C.

DOI

10.1007/s10854-018-9520-3

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-85048890442&doi=10.1007%2fs10854-018-9520-3&partnerID=40&md5=24b4147ced542b3c83629e25b47e24e6

https://scholars.lib.ntu.edu.tw/handle/123456789/432577

Publisher

Springer New York LLC

Type

journal article