Pronounced effects of Zn additions on Cu-Sn microjoints for chip-stacking applications

Journal

Journal of Alloys and Compounds

Journal Volume

750

Pages

570-576

Date Issued

2018

Author(s)

Wang Y.W.

Yang T.L.

Wu J.Y.

DOI

10.1016/j.jallcom.2018.04.028

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-85045070868&doi=10.1016%2fj.jallcom.2018.04.028&partnerID=40&md5=e4a32f2366a7ea87e477c5198e1d1bf6

https://scholars.lib.ntu.edu.tw/handle/123456789/432578

Publisher

Elsevier Ltd

Type

journal article