https://scholars.lib.ntu.edu.tw/handle/123456789/432580| Title: | Creep mechanism in characteristic orientation of Sn and Sn-1.8Ag by nanoindentation | Authors: | Chiang P.J. Wu J.Y. Liao Y.C. Kao C.R. C. ROBERT KAO |
Issue Date: | 2018 | Publisher: | Institute of Electrical and Electronics Engineers Inc. | Start page/Pages: | 222-225 | Source: | 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference | URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-85048766430&doi=10.23919%2fICEP.2018.8374707&partnerID=40&md5=08cae9ce24150eb904bf6209e77ab623 https://scholars.lib.ntu.edu.tw/handle/123456789/432580 |
ISBN: | 9784990218850 | DOI: | 10.23919/ICEP.2018.8374707 |
| Appears in Collections: | 材料科學與工程學系 |
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