https://scholars.lib.ntu.edu.tw/handle/123456789/432581
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Weng I.A. | en_US |
dc.contributor.author | Hung H.T. | en_US |
dc.contributor.author | Yang S. | en_US |
dc.contributor.author | Chen Y.H. | en_US |
dc.contributor.author | C. ROBERT KAO | en_US |
dc.creator | C. ROBERT KAO;Kao C.R.;Chen Y.H.;Yang S.;Hung H.T.;Weng I.A. | - |
dc.date.accessioned | 2019-11-27T02:02:19Z | - |
dc.date.available | 2019-11-27T02:02:19Z | - |
dc.date.issued | 2018 | - |
dc.identifier.isbn | 9784990218850 | - |
dc.identifier.uri | https://www.scopus.com/inward/record.uri?eid=2-s2.0-85048831791&doi=10.23919%2fICEP.2018.8374676&partnerID=40&md5=9c044b05b367c0ec20cee79669af18c8 | - |
dc.identifier.uri | https://scholars.lib.ntu.edu.tw/handle/123456789/432581 | - |
dc.publisher | Institute of Electrical and Electronics Engineers Inc. | - |
dc.relation.ispartof | 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference | - |
dc.title | Bonding of copper pillars using electroless Au plating | en_US |
dc.type | conference paper | en |
dc.identifier.doi | 10.23919/ICEP.2018.8374676 | - |
dc.identifier.scopus | 2-s2.0-85048831791 | - |
dc.relation.pages | 87-90 | - |
item.cerifentitytype | Publications | - |
item.fulltext | no fulltext | - |
item.openairecristype | http://purl.org/coar/resource_type/c_5794 | - |
item.openairetype | conference paper | - |
item.grantfulltext | none | - |
crisitem.author.dept | Materials Science and Engineering | - |
crisitem.author.parentorg | College of Engineering | - |
Appears in Collections: | 材料科學與工程學系 |
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