Materials merging mechanism of microfluidic electroless interconnection process

Journal

Journal of the Electrochemical Society

Journal Volume

165

Journal Issue

7

Pages

D273-D281

Date Issued

2018

Author(s)

Yang S.

Hung H.T.

Wu P.Y.

Wang Y.W.

Nishikawa H.

DOI

10.1149/2.0441807jes

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-85053548055&doi=10.1149%2f2.0441807jes&partnerID=40&md5=f2b118dde7f8a7395673d7b990ce5de0

https://scholars.lib.ntu.edu.tw/handle/123456789/432582

Publisher

Electrochemical Society Inc.

Type

journal article