Development of Die Attachment Technology for Power IC Module by Introducing Indium into Sintered Nano-Silver Joint

Journal

Electronic Components and Technology Conference

Pages

1974-1980

ISBN

9781509043323

Date Issued

2017

Author(s)

Yang C.A.

Kao C.R.

Nishikawa H.

DOI

10.1109/ECTC.2017.78

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-85028065830&doi=10.1109%2fECTC.2017.78&partnerID=40&md5=074d13ff852c0e2d18d9dd56ab0ce604

https://scholars.lib.ntu.edu.tw/handle/123456789/432585

Publisher

Institute of Electrical and Electronics Engineers Inc.

Type

conference paper