https://scholars.lib.ntu.edu.tw/handle/123456789/432585| Title: | Development of Die Attachment Technology for Power IC Module by Introducing Indium into Sintered Nano-Silver Joint | Authors: | Yang C.A. Kao C.R. Nishikawa H. C. ROBERT KAO |
Issue Date: | 2017 | Publisher: | Institute of Electrical and Electronics Engineers Inc. | Start page/Pages: | 1974-1980 | Source: | Electronic Components and Technology Conference | URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-85028065830&doi=10.1109%2fECTC.2017.78&partnerID=40&md5=074d13ff852c0e2d18d9dd56ab0ce604 https://scholars.lib.ntu.edu.tw/handle/123456789/432585 |
ISBN: | 9781509043323 | ISSN: | 05695503 | DOI: | 10.1109/ECTC.2017.78 |
| Appears in Collections: | 材料科學與工程學系 |
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