https://scholars.lib.ntu.edu.tw/handle/123456789/432586| Title: | Chip-to-Chip Direct Interconnections by Using Controlled Flow Electroless Ni Plating | Authors: | Hung H.T. Yang S. Chen Y.B. Kao C.R. C. ROBERT KAO |
Issue Date: | 2017 | Publisher: | Springer New York LLC | Journal Volume: | 46 | Journal Issue: | 7 | Start page/Pages: | 4321-4325 | Source: | Journal of Electronic Materials | URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-85014061998&doi=10.1007%2fs11664-017-5385-0&partnerID=40&md5=ce96b9b9f90045be35fee937d9c921b7 https://scholars.lib.ntu.edu.tw/handle/123456789/432586 |
ISSN: | 03615235 | DOI: | 10.1007/s11664-017-5385-0 |
| Appears in Collections: | 材料科學與工程學系 |
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