Chip-to-Chip Direct Interconnections by Using Controlled Flow Electroless Ni Plating

Journal

Journal of Electronic Materials

Journal Volume

46

Journal Issue

7

Pages

4321-4325

Date Issued

2017

Author(s)

Hung H.T.

Yang S.

Chen Y.B.

DOI

10.1007/s11664-017-5385-0

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-85014061998&doi=10.1007%2fs11664-017-5385-0&partnerID=40&md5=ce96b9b9f90045be35fee937d9c921b7

https://scholars.lib.ntu.edu.tw/handle/123456789/432586

Publisher

Springer New York LLC

Type

journal article