https://scholars.lib.ntu.edu.tw/handle/123456789/432586
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Hung H.T. | en_US |
dc.contributor.author | Yang S. | en_US |
dc.contributor.author | Chen Y.B. | en_US |
dc.contributor.author | C. ROBERT KAO | en_US |
dc.creator | C. ROBERT KAO;Kao C.R.;Chen Y.B.;Yang S.;Hung H.T. | - |
dc.date.accessioned | 2019-11-27T02:02:21Z | - |
dc.date.available | 2019-11-27T02:02:21Z | - |
dc.date.issued | 2017 | - |
dc.identifier.issn | 03615235 | - |
dc.identifier.uri | https://www.scopus.com/inward/record.uri?eid=2-s2.0-85014061998&doi=10.1007%2fs11664-017-5385-0&partnerID=40&md5=ce96b9b9f90045be35fee937d9c921b7 | - |
dc.identifier.uri | https://scholars.lib.ntu.edu.tw/handle/123456789/432586 | - |
dc.publisher | Springer New York LLC | - |
dc.relation.ispartof | Journal of Electronic Materials | - |
dc.title | Chip-to-Chip Direct Interconnections by Using Controlled Flow Electroless Ni Plating | en_US |
dc.type | journal article | en |
dc.identifier.doi | 10.1007/s11664-017-5385-0 | - |
dc.identifier.scopus | 2-s2.0-85014061998 | - |
dc.relation.pages | 4321-4325 | - |
dc.relation.journalvolume | 46 | - |
dc.relation.journalissue | 7 | - |
item.openairecristype | http://purl.org/coar/resource_type/c_6501 | - |
item.openairetype | journal article | - |
item.grantfulltext | none | - |
item.cerifentitytype | Publications | - |
item.fulltext | no fulltext | - |
crisitem.author.dept | Materials Science and Engineering | - |
crisitem.author.parentorg | College of Engineering | - |
顯示於: | 材料科學與工程學系 |
在 IR 系統中的文件,除了特別指名其著作權條款之外,均受到著作權保護,並且保留所有的權利。