Study of Sintered Nano-Silver Die Attachment Materials Doped with Indium

Journal

Electronic Components and Technology Conference

Journal Volume

2016-August

Pages

2468-2474

ISBN

9781509012039

Date Issued

2016

Author(s)

Yang C.A.

DOI

10.1109/ECTC.2016.71

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-84987809899&doi=10.1109%2fECTC.2016.71&partnerID=40&md5=70deb5325bc3977d9b5c34a69c375c6d

https://scholars.lib.ntu.edu.tw/handle/123456789/432593

Publisher

Institute of Electrical and Electronics Engineers Inc.

Type

conference paper