Choice of Intermetallic Compounds for Structural Applications in Near Submicron Joints

Journal

Electronic Components and Technology Conference

Journal Volume

2016-August

Pages

1135-1140

ISBN

9781509012039

Date Issued

2016

Author(s)

Yu J.J.

Wu J.Y.

Yu L.J.

DOI

10.1109/ECTC.2016.13

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-84987850157&doi=10.1109%2fECTC.2016.13&partnerID=40&md5=d58bf5177223243b74cf03e21d7eaf30

https://scholars.lib.ntu.edu.tw/handle/123456789/432594

Publisher

Institute of Electrical and Electronics Engineers Inc.

Type

conference paper