Pattern formation during interfacial reaction in-between liquid Sn and Cu substrates - A simulation study

Journal

Acta Materialia

Journal Volume

113

Pages

245-258

Date Issued

2016

Author(s)

Ke J.H.

Gao Y.

Kao C.R.

Wang Y.

DOI

10.1016/j.actamat.2016.05.004

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-84966709689&doi=10.1016%2fj.actamat.2016.05.004&partnerID=40&md5=9de4d4997c696e7cea96848fb1f54a86

https://scholars.lib.ntu.edu.tw/handle/123456789/432596

Publisher

Elsevier Ltd

Type

journal article