Full intermetallic joints for chip stacking by using thermal gradient bonding

Journal

Acta Materialia

Journal Volume

113

Pages

90-97

Date Issued

2016

Author(s)

Yang T.L.

Aoki T.

Matsumoto K.

Toriyama K.

Horibe A.

Mori H.

Orii Y.

Wu J.Y.

DOI

10.1016/j.actamat.2016.04.046

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-84966286578&doi=10.1016%2fj.actamat.2016.04.046&partnerID=40&md5=95b061ced933a01d92a071cff6a70710

https://scholars.lib.ntu.edu.tw/handle/123456789/432597

Publisher

Elsevier Ltd

Type

journal article