https://scholars.lib.ntu.edu.tw/handle/123456789/432597| Title: | Full intermetallic joints for chip stacking by using thermal gradient bonding | Authors: | Yang T.L. Aoki T. Matsumoto K. Toriyama K. Horibe A. Mori H. Orii Y. Wu J.Y. Kao C.R. C. ROBERT KAO |
Issue Date: | 2016 | Publisher: | Elsevier Ltd | Journal Volume: | 113 | Start page/Pages: | 90-97 | Source: | Acta Materialia | URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-84966286578&doi=10.1016%2fj.actamat.2016.04.046&partnerID=40&md5=95b061ced933a01d92a071cff6a70710 https://scholars.lib.ntu.edu.tw/handle/123456789/432597 |
ISSN: | 13596454 | DOI: | 10.1016/j.actamat.2016.04.046 |
| Appears in Collections: | 材料科學與工程學系 |
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