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College of Engineering / 工學院
Materials Science and Engineering / 材料科學與工程學系
Full intermetallic joints for chip stacking by using thermal gradient bonding
Details
Full intermetallic joints for chip stacking by using thermal gradient bonding
Journal
Acta Materialia
Journal Volume
113
Pages
90-97
Date Issued
2016
Author(s)
Yang T.L.
Aoki T.
Matsumoto K.
Toriyama K.
Horibe A.
Mori H.
Orii Y.
Wu J.Y.
C. ROBERT KAO
DOI
10.1016/j.actamat.2016.04.046
URI
https://www.scopus.com/inward/record.uri?eid=2-s2.0-84966286578&doi=10.1016%2fj.actamat.2016.04.046&partnerID=40&md5=95b061ced933a01d92a071cff6a70710
https://scholars.lib.ntu.edu.tw/handle/123456789/432597
Publisher
Elsevier Ltd
Type
journal article