Bonding of copper pillars using electroless Ni plating

Journal

2016 International Conference on Electronics Packaging

Pages

493-496

ISBN

9784904090176

Date Issued

2016

Author(s)

Yang S.

Hung H.T.

Chen Y.B.

DOI

10.1109/ICEP.2016.7486876

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-84978224582&doi=10.1109%2fICEP.2016.7486876&partnerID=40&md5=1ba56af57bd833b6ff6445e9628b6c53

https://scholars.lib.ntu.edu.tw/handle/123456789/432600

Publisher

Institute of Electrical and Electronics Engineers Inc.

Type

conference paper