Interfacial Energy Effect on the Distribution of Ag3Sn in Full Intermetallic Joints
Journal
Advanced Engineering Materials
Journal Volume
17
Journal Issue
11
Pages
1528-1531
Date Issued
2015
Author(s)
Abstract
Intermetallics, including Cu 6 Sn 5 , Ni 3 Sn 4 , and Ag 3 Sn, are to be used for structural applications in microjoints of three‐dimensional integrated circuits. However, the phase distribution behavior of Ag 3 Sn particles in Cu 6 Sn 5 is very different from that in Ni 3 Sn 4 . It is shown for the first time that the interfacial free energies between these intermetallics are responsible for this difference. It is found that the interfacial energy between Cu 6 Sn 5 and Ag 3 Sn is very low, even lower than the Cu 6 Sn 5 grain boundary energy.
SDGs
Publisher
Wiley-VCH Verlag
Type
journal article