Reduction of electromigration damage in SAC305 solder joints by adding Ni nanoparticles through flux doping

Journal

Journal of Materials Science

Journal Volume

50

Journal Issue

20

Pages

6748-6756

Date Issued

2015

Author(s)

Bashir M.N.

Haseeb A.S.M.A.

Rahman A.Z.M.S.

Fazal M.A.

DOI

URI

Publisher

Kluwer Academic Publishers

Type

journal article