Development of interconnection materials for Bi2Te3 and PbTe thermoelectric module by using SLID technique
Journal
Electronic Components and Technology Conference
Journal Volume
2015-July
Pages
1470-1476
ISBN
9781479986095
Date Issued
2015
Author(s)
Li C.C.
Hsu S.J.
Lee C.C.
Liao L.L.
Dai M.J.
Liu C.K.
Zhu Z.X.
Yang H.W.
Ke J.H.
Kao C.R.
Snyder G.J.
Publisher
Institute of Electrical and Electronics Engineers Inc.
Type
conference paper