https://scholars.lib.ntu.edu.tw/handle/123456789/432604| Title: | Development of interconnection materials for Bi2Te3 and PbTe thermoelectric module by using SLID technique | Authors: | Li C.C. Hsu S.J. Lee C.C. Liao L.L. Dai M.J. Liu C.K. Zhu Z.X. Yang H.W. Ke J.H. Kao C.R. Snyder G.J. C. ROBERT KAO |
Issue Date: | 2015 | Publisher: | Institute of Electrical and Electronics Engineers Inc. | Journal Volume: | 2015-July | Start page/Pages: | 1470-1476 | Source: | Electronic Components and Technology Conference | URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-84942119669&doi=10.1109%2fECTC.2015.7159791&partnerID=40&md5=cab3d8300bf8d79ed715ec1bc67ae510 https://scholars.lib.ntu.edu.tw/handle/123456789/432604 |
ISBN: | 9781479986095 | ISSN: | 05695503 | DOI: | 10.1109/ECTC.2015.7159791 |
| Appears in Collections: | 材料科學與工程學系 |
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