Low temperature bonding for high temperature applications by using SnBi solders

Journal

Journal of Alloys and Compounds

Journal Volume

647

Pages

681-685

Date Issued

2015

Author(s)

Yang T.L.

Wu J.Y.

Li C.C.

Yang S.

DOI

10.1016/j.jallcom.2015.05.249

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-84947728410&doi=10.1016%2fj.jallcom.2015.05.249&partnerID=40&md5=e09e03fad804a879a3870f3305d15871

https://scholars.lib.ntu.edu.tw/handle/123456789/432605

Publisher

Elsevier Ltd

Type

journal article