https://scholars.lib.ntu.edu.tw/handle/123456789/432613| Title: | Effects of silver addition on Cu-Sn microjoints for chip-stacking applications | Authors: | Yang T.L. Yu J.J. Shih W.L. Hsueh C.H. Kao C.R. C. ROBERT KAO |
Issue Date: | 2014 | Publisher: | Elsevier BV | Journal Volume: | 605 | Start page/Pages: | 193-198 | Source: | Journal of Alloys and Compounds | URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-84899514236&doi=10.1016%2fj.jallcom.2014.03.165&partnerID=40&md5=8c61b6d653c7814d333568fd7833bb3c https://scholars.lib.ntu.edu.tw/handle/123456789/432613 |
ISSN: | 09258388 | DOI: | 10.1016/j.jallcom.2014.03.165 |
| Appears in Collections: | 材料科學與工程學系 |
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