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College of Engineering / 工學院
Materials Science and Engineering / 材料科學與工程學系
Effects of silver addition on Cu-Sn microjoints for chip-stacking applications
Details
Effects of silver addition on Cu-Sn microjoints for chip-stacking applications
Journal
Journal of Alloys and Compounds
Journal Volume
605
Pages
193-198
Date Issued
2014
Author(s)
Yang T.L.
Yu J.J.
Shih W.L.
CHUN-HWAY HSUEH
C. ROBERT KAO
DOI
10.1016/j.jallcom.2014.03.165
URI
https://www.scopus.com/inward/record.uri?eid=2-s2.0-84899514236&doi=10.1016%2fj.jallcom.2014.03.165&partnerID=40&md5=8c61b6d653c7814d333568fd7833bb3c
https://scholars.lib.ntu.edu.tw/handle/123456789/432613
Publisher
Elsevier BV
Type
journal article