Effects of silver addition on Cu-Sn microjoints for chip-stacking applications

Journal

Journal of Alloys and Compounds

Journal Volume

605

Pages

193-198

Date Issued

2014

Author(s)

Yang T.L.

Yu J.J.

Shih W.L.

CHUN-HWAY HSUEH

DOI

10.1016/j.jallcom.2014.03.165

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-84899514236&doi=10.1016%2fj.jallcom.2014.03.165&partnerID=40&md5=8c61b6d653c7814d333568fd7833bb3c

https://scholars.lib.ntu.edu.tw/handle/123456789/432613

Publisher

Elsevier BV

Type

journal article