https://scholars.lib.ntu.edu.tw/handle/123456789/432620| Title: | Effects of Sn grain orientation on substrate dissolution and intermetallic precipitation in solder joints under electron current stressing | Authors: | Huang T.C. Yang T.L. Ke J.H. Hsueh C.H. Kao C.R. C. ROBERT KAO |
Issue Date: | 2014 | Publisher: | Elsevier Ltd | Journal Volume: | 80 | Start page/Pages: | 37-40 | Source: | Scripta Materialia | URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-84897915232&doi=10.1016%2fj.scriptamat.2014.02.010&partnerID=40&md5=fc684539074d569d75e2bdbe02a4fde9 https://scholars.lib.ntu.edu.tw/handle/123456789/432620 |
ISSN: | 13596462 | DOI: | 10.1016/j.scriptamat.2014.02.010 |
| Appears in Collections: | 材料科學與工程學系 |
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