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College of Engineering / 工學院
Materials Science and Engineering / 材料科學與工程學系
Grain refinement of solder materials by minor element addition
Details
Grain refinement of solder materials by minor element addition
Journal
International Microsystems, Packaging, Assembly, and Circuits Technology Conference
Pages
124-127
ISBN
9781479906673
Date Issued
2013
Author(s)
Chung C.K.
Yu J.J.
Yang T.L.
C. ROBERT KAO
DOI
10.1109/IMPACT.2013.6706650
URI
https://www.scopus.com/inward/record.uri?eid=2-s2.0-84893963682&doi=10.1109%2fIMPACT.2013.6706650&partnerID=40&md5=067c5fbe102ab941c842943dce2476aa
https://scholars.lib.ntu.edu.tw/handle/123456789/432621
SDGs
[SDGs]SDG9
Type
conference paper
