https://scholars.lib.ntu.edu.tw/handle/123456789/432621
Title: | Grain refinement of solder materials by minor element addition | Authors: | Chung C.K. Yu J.J. Yang T.L. C. ROBERT KAO |
Issue Date: | 2013 | Start page/Pages: | 124-127 | Source: | International Microsystems, Packaging, Assembly, and Circuits Technology Conference | URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-84893963682&doi=10.1109%2fIMPACT.2013.6706650&partnerID=40&md5=067c5fbe102ab941c842943dce2476aa https://scholars.lib.ntu.edu.tw/handle/123456789/432621 |
ISBN: | 9781479906673 | ISSN: | 21505934 | DOI: | 10.1109/IMPACT.2013.6706650 |
Appears in Collections: | 材料科學與工程學系 |
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