Assembly of N type Bi2(Te, Se)3 thermoelectric modules by low temperature bonding
Journal
Science and Technology of Welding and Joining
Journal Volume
18
Journal Issue
5
Pages
421-424
Date Issued
2013
Author(s)
Abstract
Solid liquid interdiffusion technique is employed to attach N type Bi 2 (Te 0·92 Se 0·08 ) 3 thermoelectric material to alumina substrate. The surface finishes of the bonding surfaces for Bi 2 (Te 0·92 Se 0·08 ) 3 and alumina are Ni and Ag respectively. The bonding layer is pure Sn. The growth kinetic of intermetallic compounds and their microstructure evolution during aging at 200°C was established. The success of this bonding technique provides a cost effective way to assemble thermoelectric modules at a low temperature for higher temperature applications.
Type
journal article