Assembly of N type Bi2(Te, Se)3 thermoelectric modules by low temperature bonding

Journal

Science and Technology of Welding and Joining

Journal Volume

18

Journal Issue

5

Pages

421-424

Date Issued

2013

Author(s)

Li C.C.

Zhu Z.X.

Liao L.L.

Dai M.J.

Liu C.K.

DOI

10.1179/1362171813Y.0000000116

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-84882639204&doi=10.1179%2f1362171813Y.0000000116&partnerID=40&md5=f29f16f1eb2e95dc9b763647aaf0db21

https://scholars.lib.ntu.edu.tw/handle/123456789/432625

Type

journal article