https://scholars.lib.ntu.edu.tw/handle/123456789/432626| Title: | Au and Pd embrittlement in space-confined soldering reactions for 3D IC applications | Authors: | Chen Y.J. Huang K.Y. Chen H.T. Kao C.R. C. ROBERT KAO |
Issue Date: | 2013 | Start page/Pages: | 102-112 | Source: | International Symposium on Advanced Packaging Materials | URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-84878871756&doi=10.1109%2fISAPM.2013.6510393&partnerID=40&md5=070027945347d8e899763b8452076dfe https://scholars.lib.ntu.edu.tw/handle/123456789/432626 |
ISSN: | 15505723 | DOI: | 10.1109/ISAPM.2013.6510393 |
| Appears in Collections: | 材料科學與工程學系 |
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