Au and Pd embrittlement in space-confined soldering reactions for 3D IC applications

Journal

International Symposium on Advanced Packaging Materials

Pages

102-112

Date Issued

2013

Author(s)

Chen Y.J.

Huang K.Y.

Chen H.T.

DOI

10.1109/ISAPM.2013.6510393

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-84878871756&doi=10.1109%2fISAPM.2013.6510393&partnerID=40&md5=070027945347d8e899763b8452076dfe

https://scholars.lib.ntu.edu.tw/handle/123456789/432626

Type

conference paper