https://scholars.lib.ntu.edu.tw/handle/123456789/432631| Title: | Cu(TiWNx) film as a barrierless buffer layer for metallization applications | Authors: | Lin C.-H. Chuang H.-Y. Kao C.R. C. ROBERT KAO |
Issue Date: | 2013 | Journal Volume: | 52 | Journal Issue: | 1 PART2 | Source: | Japanese Journal of Applied Physics | URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-84872854087&doi=10.7567%2fJJAP.52.01AC12&partnerID=40&md5=c077c0d2983b62505311233806b764ee https://scholars.lib.ntu.edu.tw/handle/123456789/432631 |
ISSN: | 00214922 | DOI: | 10.7567/JJAP.52.01AC12 |
| Appears in Collections: | 材料科學與工程學系 |
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