Cu(TiWNx) film as a barrierless buffer layer for metallization applications

Journal

Japanese Journal of Applied Physics

Journal Volume

52

Journal Issue

1 PART2

Date Issued

2013

Author(s)

Lin C.-H.

Chuang H.-Y.

DOI

10.7567/JJAP.52.01AC12

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-84872854087&doi=10.7567%2fJJAP.52.01AC12&partnerID=40&md5=c077c0d2983b62505311233806b764ee

https://scholars.lib.ntu.edu.tw/handle/123456789/432631

Type

journal article