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College of Engineering / 工學院
Materials Science and Engineering / 材料科學與工程學系
Cu(TiWNx) film as a barrierless buffer layer for metallization applications
Details
Cu(TiWNx) film as a barrierless buffer layer for metallization applications
Journal
Japanese Journal of Applied Physics
Journal Volume
52
Journal Issue
1 PART2
Date Issued
2013
Author(s)
Lin C.-H.
Chuang H.-Y.
C. ROBERT KAO
DOI
10.7567/JJAP.52.01AC12
URI
https://www.scopus.com/inward/record.uri?eid=2-s2.0-84872854087&doi=10.7567%2fJJAP.52.01AC12&partnerID=40&md5=c077c0d2983b62505311233806b764ee
https://scholars.lib.ntu.edu.tw/handle/123456789/432631
Type
journal article